METHOD FOR FLIP CHIP PACKAGING AND PRINTING CIRCUIT BOARD

摘要

PURPOSE: A flip chip packaging method is provided to maintain the accuracy of the gap formed between the flip chip and the circuit board and to improve the contacting efficiency. CONSTITUTION: A flip chip packaging comprises the steps of: coating the underfill resin(400) between contact terminals(110) formed on the conductive layer being printed with the copper coating film by a regular circuit pattern on a circuit board(100); contacting of a bumper(300) to the contact terminals by downward pressurizing the flip chip(200) after arranging the bumper to be complementarily contacted with the contact terminals; and packaging a flip chip(200) onto the circuit board by hardening the underfill resin.