WAFER CHIPPING TEST SYSTEM AND METHOD THEREOF

摘要

PURPOSE: A method for testing wafer is provided to improve selecting a failed wafer. CONSTITUTION: The method comprises the steps of: rotating a wafer with a predetermined revolution per minute; illuminating the wafer to brighten a edge of the wafer; taking a picture of a brightening edge of the wafer; setting a video signal to a predetermined window by an image processor; separating the window into two parts; setting a new sub-window to make the edge lines of the separated windows be located in a same line; measuring a canonical correlation coefficient of the respective sub-window; and comparing the canonical correlation coefficient with a predetermined reference value.