发明名称 PIPELINE FIXING APPARATUS OF SEMICONDUCTOR DEVICE FABRICATING EQUIPMENT
摘要 PURPOSE: A pipeline fixing apparatus is provided to easily dismantle pipelines installed in a semiconductor device equipment. CONSTITUTION: The apparatus comprises a body; a bed supporting the body; a connecting axis connecting the body to the bed, wherein length of the connecting axis is variable; and a pair of branches, horizontally extended from one side and the other side of the body to an upper portion of the body, of which an end has a supporter. In the apparatus, the branch is coupled to the body and length of the branch is horizontally variable.
申请公布号 KR20000007556(A) 申请公布日期 2000.02.07
申请号 KR19980026957 申请日期 1998.07.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYOO, CHUN UK
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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