发明名称 RESIN COMPOSITION FOR SEALING ELECTRONIC COMPONENT, PRODUCTION THEREOF, AND SEALING ELECTRONIC COMPONENT, USING THE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition excellent in reliability of humidity resistance and moldability by compounding a straight-chain polyarylene sulfide resin with an inorganic ion exchanger, a specified ethylene copolymer, and an inorganic filler. SOLUTION: This composition comprises a straight-chain polyarylene sulfide resin, desirably, a poly-p-phenylene sulfide comprising at least 70 wt.% p- phenylene sulfide units; an inorganic ion exchanger; an ethylene copolymer comprising ethylene, an alkylα,β-unsaturated carboxylate, and maleic anhydride; and an inorganic filler. The ethylene copolymer is desirably the one comprising 50-90 wt.% ethylene, 3-49 wt.% alkylα,β-unsaturated carboxylate, and 0.5-10 wt.% maleic anhydride, The inorganic ion exchanger is desirably the one represented by the formula: SbaBibOc(OH)d(NO3)e.nH2O (wherein (a) and (b) are each 1-2; (c) is 1-7; (d) is 0.2-3; (e) is 0.05-3; and (n) is 0-2).
申请公布号 JP2000034407(A) 申请公布日期 2000.02.02
申请号 JP19980203248 申请日期 1998.07.17
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMAMOTO HIROSHI;HASHIMOTO SHINJI;OTSU MASAAKI
分类号 C08K3/28;C08K3/36;C08K7/14;C08K9/06;C08L23/08;C08L81/02;H01L23/29;H01L23/31;(IPC1-7):C08L81/02 主分类号 C08K3/28
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