发明名称 ROOM TEMPERATURE CURING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having curability, especially capable of shortening a time required to attain the development of adhesiveness by including an organic polymer containing a specific reactive end group and an epoxy resin as essential components. SOLUTION: This composition comprises (A) a polymer containing a hydrolyzable silicon group of the formula (R1 is a 1-20C monofunctional organic group; X is a hydroxyl group or a hydrolyzable group; (a) is 1, 2 or 3) in which the polymer is partially or wholly a polymer containing a group in which (a) is 3 in the formula and (B) an epoxy resin as essential components. The component A has preferably 8,000-50,000 molecular weight. The component A is preferably a polyoxyalkylene polymer having a molecular weight distribution Mw/Mn of <=1.7, containing the hydrolyzable silicon group of the formula. The ratio of the component B used is in the ratio of A/B of preferably 100/1 to 100/300 by weight. Consequently excellent adhesiveness to various substrates can be exhibited in a short time.
申请公布号 JP2000034391(A) 申请公布日期 2000.02.02
申请号 JP19980204041 申请日期 1998.07.17
申请人 ASAHI GLASS CO LTD 发明人 DOI TAKAO;MATSUMOTO TOMOKO
分类号 C08L51/08;C08G65/12;C08G65/32;C08L63/00;C08L71/02;C08L101/10;(IPC1-7):C08L63/00 主分类号 C08L51/08
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