发明名称 INTEGRATED CIRCUIT WITH SEVERAL COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
摘要 An integrated circuit arrangement having a number of structural elements, at least one of which is surrounded by a metallic shielding structure. This structural element is thus protected against interference due to disturbing impulses from its environment. In particular, the structural elements of the circuit arrangement can be arranged next to or on top of one another. To produce the metallic shielding structure of a structural element of the circuit arrangement, at least one depression which surrounds the structural element is created and then lined with metal. The contacts and electrical connections of the structural element are electrically insulated from the metal of the shielding structure. To connect two structural elements within a three-dimensional circuit arrangement, the surfaces of the structural elements that face one another can be covered with two different metals, the alloy thereof having a melting point TS above the melting point T1 of at least one of the metals, so that heating to a temperature between the two melting points results in a permanent connection.
申请公布号 EP0976156(A1) 申请公布日期 2000.02.02
申请号 EP19980925394 申请日期 1998.03.13
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ANTHOFER, ANTON;HUEBNER, HOLGER
分类号 H01L27/00;H01L21/762;H01L23/552;H01L23/60;(IPC1-7):H01L23/60;H01L27/06 主分类号 H01L27/00
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