| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly refined and reliable printed wiring board, by inactivating a palladium remaining on the surface of an insulation layer as a catalyst so as to improve the insulation property of a circuit pattern, in a method for manufacturing a printed wiring board using an additive method to form the circuit pattern by a copper plated layer formed on the surface of the insulation layer. SOLUTION: After a circuit pattern is formed, a laminated body 10 in which a palladium appears is dipped in a dilute hydrochloric acid solution so as to remove etching residue, etc., such as iron hydroxide, etc., adhered to the surface of the laminated body 10, making its surface clean (A). Then the laminated body 10 is picked up and washed with water to remove the adhered dilute hydrochloric acid solution (B). Further, the laminated body 10 is dipped in a thiosulfuric acid compound solution of 200 W% to inactivate palladium ions on the surface of the insulation layer, so that their catalytic function is lost (C).
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