发明名称 Solder material
摘要 A solder material optimum in the melting temperature as a solder material, superior in mechanical properties and in wettability and capable of assuring excellent soldering performance. For a Sn-Zn-Bi based solder material, germanium and cooper is added, while germanium and further copper are added for a Sn-Bi-Ag based solder material and germanium and silver are added for a Sn-Zn-In based solder material. <IMAGE>
申请公布号 EP0976489(A1) 申请公布日期 2000.02.02
申请号 EP19980114337 申请日期 1998.07.30
申请人 SONY CORPORATION 发明人 HABU, KAZUTAKA;TAKEDA, NAOKO
分类号 B23K35/26;C22C13/00;C22C13/02;H05K3/34 主分类号 B23K35/26
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