发明名称 Apparatus for coating a semiconductor wafer with a photoresist
摘要 An apparatus coats a semiconductor wafer with photoresist that is to be etched in the manufacture of the semiconductor. The apparatus includes a body having an open top, a spin chuck for revolving a wafer fixed thereon at a uniform rate, a bowl for preventing photoresist from spattering on the body and which is installed inside the body, a photoresist dispensing nozzle for spraying photoresist on the wafer, a side rinse nozzle for removing photoresist adhered to the peripheral edge of the wafer, a cover for opening/closing the top of the body, and a cleaning device associated with the cover for cleaning the bowl. The apparatus allows the bowl to be cleaned while the cover is closed and the bowl is still disposed inside the body. The cleaning device includes a sprinkler and a pump.
申请公布号 US6019843(A) 申请公布日期 2000.02.01
申请号 US19980019118 申请日期 1998.02.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, SUNG-HYEON;KIM, SUNG-IL
分类号 B05B15/02;B05C11/08;G03F7/16;H01L21/027;(IPC1-7):B05C5/00 主分类号 B05B15/02
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