| 发明名称 |
Liquid crystal polymer encapsulant |
| 摘要 |
Molding compounds for encapsulating electronic components are disclosed. The molding compounds employ liquid crystal polymer resins and fillers coated with non-polar silane coupling agents to reduce the viscosity of the compounds. |
| 申请公布号 |
AU4857499(A) |
申请公布日期 |
2000.02.01 |
| 申请号 |
AU19990048574 |
申请日期 |
1999.07.02 |
| 申请人 |
COOKSON SEMICONDUCTOR PACKAGING MATERIALS |
发明人 |
PAUL A. KONING |
| 分类号 |
C08K9/06 |
主分类号 |
C08K9/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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