发明名称 |
TIE-BAR CUTTING APPARATUS OF SEMICONDUCTOR PACKAGE |
摘要 |
<p>An apparatus for cutting tie bars of semiconductor packages unloads the semiconductor packages by continuously blowing air against the side of the packages after the tie bars are cut and the semiconductor packages are separated from lead frames. The packages are blown into a guide track which feeds into a storage tube. As a result, damage to the packages due to mechanical abrasion which may result from unloading with a pusher bar is prevented. Furthermore, the time required for unloading the semiconductor packages is reduced.</p> |
申请公布号 |
KR100242947(B1) |
申请公布日期 |
2000.02.01 |
申请号 |
KR19970047401 |
申请日期 |
1997.09.13 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
KIM, JONG WON;CHOI, YOUNG JIN;KO, JUN YOUNG;PARK, PO SEONG |
分类号 |
B21D28/00;B21D45/04;B26D7/18;H01L21/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 |
主分类号 |
B21D28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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