| 摘要 |
The present invention is used with single devices mounted on a ceramic substrate. The devices are broken out of the sheet, after all testing, electrical conditioning, and screening, as small surface mount devices. Conductive strips are formed on the ceramic substrate and are spaced to match a standard circuit board edge connector. These strips are electrically connected to the devices to allow testing and burn-in in sheet form rather than testing each device individually. The design reduces handling of the individual devices. The invention allows all of the testing and assembly to be done in a "batch" fashion. The board that is used to test the devices is separated to create the package for the individual components. The technique of the invention reduces cost and handling damage.
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