MULTILAYER WIRING BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a high-density and low-cost multilayer wiring board and a method for manufacturing the same. SOLUTION: A first wiring board 101 provided with a specified insulating layer and a wiring layer, and a second wiring board 102 provided with a specified insulating layer and a wiring layer, are laminated through a board bonding element 106 provided with a through hole filled with a conductor 105. A wiring layer 107 in the surface layer of the first wiring board 101 and a wiring layer 108 in the surface layer of the second wiring board 102 are electrically connected through the conductor 105 and at least one of the wiring layers 107 and 108 is buried in the board bonding element 106. In this way, the wiring boards 101 and 102 separately formed can be integrated and electrically joined by the conductor 105 in the through hole 104 provided in the board bonding element 106, and a high-density and low-cost multilayer wiring board can be obtained.