发明名称 DEVICE AND METHOD FOR SUBSTRATE TREATMENT
摘要 PROBLEM TO BE SOLVED: To efficiently reduce oxidizing species which are mixed in into a reaction chamber. SOLUTION: A device has a reaction chamber 301, which can treat a substrate 305 to be treated in a heated condition and a carrier chamber 304 for holding the substrate 305 to be carried into the reaction chamber 301. The carrier chamber 304 has a cooling mechanism 310 which adsorbs substances contained in the atmosphere as solids.
申请公布号 JP2000031065(A) 申请公布日期 2000.01.28
申请号 JP19980195975 申请日期 1998.07.10
申请人 TOSHIBA CORP 发明人 AKASAKA YASUSHI
分类号 H01L21/205;H01L21/324;(IPC1-7):H01L21/205 主分类号 H01L21/205
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