| 摘要 |
PROBLEM TO BE SOLVED: To provide the flip chip bonding method of a semiconductor device using a solder material not containing Pb at 11 in the manufacture of a printed circuit board for the flip chip bonding and a packaging circuit board using the flip chip bonding process. SOLUTION: This manufacturing method contains the three steps mentioned as follows, i.e., the first step of forming a solder bump 3 using the solder materials containing 90 wt.%-97 wt.% of Sn and 3 wt.%-10 wt.% of Ag or 90 wt.%-97 wt.% of Sn and 3 wt.%-10 wt.% of Sb on a semiconductor chip CH, the second step of forming an electrode having In, In-Sn alloy or the topmost layer of In-Bi alloy on a printed circuit board PC as well as the third step of arranging the solder bump 3 on the electrode while flip chip bonding the semiconductor chop CH on the printed circuit board PC. |
