| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which allows easy formation of an upper face pattern and prevents the damage of a bottom section at the time of making a blind via hole by laser and also provide a printed wiring board manufactured by such a method. SOLUTION: This method includes a process in which an upper and a lower face of an insulating substrate 5 are covered with an upper face metal foil 210 and a lower face metal foil 220, with a thickness (t) of the upper face metal foil being less than that T of the lower face metal foil, a process wherein an openning hole 213 is formed in the upper face metal foil located on a blind via hole formation section 35 of the insulating substrate, a process wherein laser beam 8 is emitted on the blind via hole formation section 35 to form a blind via hole 3 with the lower face metal foil as a bottom, a process in which a metal plated film 23 is formed on an inner wall of the blind via hole 3, and a process wherein an upper face pattern 21 and a lower face pattern 22 are formed through etching. The thickness (t) of the upper face pattern is smaller than that of the lower face pattern T. |
