| 摘要 |
PROBLEM TO BE SOLVED: To enable a circuit mounted on a semiconductor chip to detect whether or not a bonding wire is connected to a part of a bonding pad from a signal taken out of the part, by dividing a bonding pad into two parts at least. SOLUTION: A bonding pad 1 is divided into two parts 3, 4 and the parts 3, 4 are separated by an interval 5. Electric resistance between the parts 3, 4 is almost infinite if they are not connected by a bonding wire. However, if the parts 3, 4 are connected by a bonding wire 2, resistance between the parts 3, 4 is approximately 0. For example, when the part 4 alone is electrically connected to the bonding wire 2, connection of the bonding pad 1 by the bonding wire 2 is 'defective'. The state is immediately detected by a circuit provided to a semiconductor chip and it is possible to determine whether or not a semiconductor chip itself is subjected to proper bonding. |
