| 摘要 |
PROBLEM TO BE SOLVED: To perform exposure, while placing the surface of a substrate such as a wafer on the image plane of a projection optical system with high accuracy, even when a travel surface and the image plane are not parallel when the substrate is moved. SOLUTION: When scan exposure is carried out by moving the wafer W with respect to an exposure region 3 of a projection optical PL via an XY stage 13, in synchronism with the movement of a reticle R to a lit area 2 via a reticle stage 4, multipoint AF sensors 19A and 19B pre-read a focus position on the surface of the wafer W, and the surface of the wafer W is placed on the image plane of the projection optical system PL through an automatic focusing system. At exposing, the quantity of variation of the attitude of a sample base 11, where the wafer W is mounted is measured by using a laser interferometer 16Y, etc., and according to the measurement results, a target value of the attitude of the sample base 11 for a wafer to be exposed next is set.
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