| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor component in which mechanical stresses are suppressed, and a method for coupling a semiconductor element with a substrate. SOLUTION: A semiconductor component 31 contains a saddle 34 and a semiconductor element 36. The saddle 34 has a plurality of side faces 51, 52, 53, 54, and 55 forming a semiconductor element accepting area 58. The semiconductor element 36 is inserted into the semiconductor element accepting area 58 and fixed in the area 58 by using tabs 66 and 67. The saddle 34 is coupled with a substrate by means of clamping tools.
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