METHOD AND APPARATUS FOR APPLYING RESIST

摘要

PROBLEM TO BE SOLVED: To make uniform the thickness of resist formed on the surface of a wafer and to reduce the wastage of resists. SOLUTION: This method for coating the surface of a wafer 12, having a step on its surface with the resist 13, is characterized in that the surface of the wafer 12 is coated with the resist 13 by an ink jet system from a nozzle 11 which is capable of scanning the surface in an X and a Y-direction.