摘要 |
PROBLEM TO BE SOLVED: To increase heat capacity of a heating part and a leading wire part, to suppress abrupt temperature rising and to prevent damage by bringing a heat radiating member into contact with the leading wire part for supplying heating power to a heat generating resistance wire body installed on a base plate of the heating part, and controlling temperature of a temperature controlling object placed on the heating part. SOLUTION: The specified heating power is supplied from leading wire parts 41b, 42b to first and second heat generating resistance wire bodies 41, 42 installed on a hollow base plate 20 with high heat conductivity through a thin film heater 40. A zone heating part of the resistance wire bodies 41, 42 comes in contact with the top surface of the base plate 20, and heat radiating members 50, 51 are brought into contact with the leading wire parts 41b, 42b to sufficiently increase heat capacity. Cycles heating a wafer W placed on the zone heating part to high temperature and cooling it to room temperature are controlled at intervals of several ten seconds with fluid having a temperature of about 20 deg.C in a heat storage tank 31. Sharp temperature increase in the zone heating part and the leading wire parts is suppressed, and damage caused by heat is prevented.
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