LEAD FRAME WITH SELECTIVE PALLADIUM PLATING

摘要

PROBLEM TO BE SOLVED: To provide a lead frame having a palladium surface to be used for assembling a semiconductor device. SOLUTION: By plating the inner lead frame with 1-microinch thick palladium and the outer leads contacting solder with 3-microinch thick palladium 306 a lead frame can be obtained with preferable properties of palladium-plated lead frames such as compatibility with wire bonding and solder reflow and favorable adhesion to the molding compound. There is provided a low-cost method for manufacturing lead frames on the basis of unique combination of conventional processes.