| 摘要 |
Heat sink apparatus (100) for use in an enclosure (12) in which electrical components installed on circuits boards (42, 44, 48, 50) are mounted in the enclosure in a stacked arrangement (30) with the components in proximity to each other. Heat conductive plates (102) are also formed in a stacked arrangement and are inserted between adjacent circuit boards in an interdigitated manner for heat generated by the components to be conducted away from the components by the plates. A plurality of pouches (106, 116) containing a liquid heat sink material or surface comformable, conductive elastomer pads are inserted between each side of each heat conductive plates and the printed circuit boards, and between sidewalls (51, 52, 18) of the enclosure and the stack of heat conductive plates. The heat sink apparatus (100) increases the efficiency of heat transfer away from the components so as to prevent the components from overheating by providing a heat conduction, transfer path from the components (118) to the enclosure (12).
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