| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject new resin having excellent solubility in other epoxy resins and a curing agent and improved adhesiveness by reacting a specific imide with an epoxy resin and by including a phthalimide structure. SOLUTION: This epoxy resin is obtained by reacting (A) a hydroxy- substituted or carboxy-substituted imide with (B) an epoxy resin and contains 0.1-7 wt.% phthalimide structure of the formula in the whole epoxy resin. The component A is obtained, for example, by reacting a carboxylic acid such as hydroxyphthalic acid, etc., with an amino compound such as an aminophenol, etc. A biphenol novolak type epoxy resin, etc., is preferable as the component B. The reaction is carried out in the presence of 0.01-5 wt.% of an epoxy curing catalyst based on the component B at 50-150 deg.C by using the components A and B so as to make the amount of the structure of the formula 0.1-7 wt.% and the equivalent ratio of the epoxy group to the hydroxyl group or the carboxy group of >=2.
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