| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for obtaining a pressure-sensitive adhesive nonproblematic in the heat-resistant holding power of a hot-melt adhesive, the emission of a pungent order of residual monomer of an acrylic resin pressure-sensitive adhesive, low pressure-sensitive holding power, etc. SOLUTION: There is provided a UV-curable pressure-sensitive adhesive composition comprising 20-50 pts.wt. epoxy compound (A) having a molecular weight of 2,500 or below and an internal epoxy group, 5-50 pts.wt. compound (B) having a functional group reactive with the epoxy group and having a molecular weight of 6,000 or below, 5-40 pts.wt. compound (C) having a molecular weight of 10,000-2,000,000, a solubility of at least 5 wt.% in epoxy compound A and/or compound B, and a tensile elongation at break of 600% or above, and 0.01-10 pts.wt. cationic curing catalyst (D).
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