发明名称 MOLD RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To enable a mold release film parting layer to be peeled with an appropriate force to eliminate a defective peeling by specifying the rapid peeling force of a pressure sensitive adhesive applied on the opposite side face to the polyester film side of a silicone parting layer. SOLUTION: A silicone parting layer shows 80 g/25 mm wide or less pressure sensitive adhesive rapid peeling force on the opposite side face to the polyester film side. In order to obtain this pressure sensitive adhesive rapid peeling force, the ratio of a vinyl group to be introduced into a silicone resin is increased in the silicone resin of an addition reaction series having the vinyl group. Further in the silicone resin of a condensation reaction series, the ratio of a -OH group and a -H group to be introduced into the silicone resin is increased. Further in the silicone resin of an ultravioletor an electron beam-curable reaction series, the ratio of an unsaturated group as a crosslinking reaction point is increased. Thus the pressure sensitive adhesive rapid peeling force is obtained by increasing the crosslink density of the silicone resin by the described methods.
申请公布号 JP2000025163(A) 申请公布日期 2000.01.25
申请号 JP19980194355 申请日期 1998.07.09
申请人 TOYOBO CO LTD 发明人 HOSHIO ATSUSHI;MAEDA KOZO;KUBO YOSHIMASA
分类号 B32B27/00;(IPC1-7):B32B27/00 主分类号 B32B27/00
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