MANUFACTURING METHOD OF BGA TYPE SEMICONDUCTOR DEVICE, TAB TAPE FOR BGA SEMICONDUCTOR DEVICE, AND BGA TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A manufacturing method of BGA type semiconductor device, TAB tape for BGA semiconductor device, and BGA type semiconductor device is provided to prevent the separation of an electrode pad and a lead and the crack of sealing resin, therefore to enhance productivity and reliability. CONSTITUTION: The manufacturing method of BGA type semiconductor device comprises: a step forming an opened part in periphery of respective loading area about a TAB(tape automated bonding) tape with reminding the connecting part for connecting a chip loading area to other areas; a step loading a semiconductor chip on respective chip loading area of the TAB tape; a step connecting the electrode pad of the semiconductor chip with a wiring pattern of the TAB tape by bonding; a step sealing the bonded connecting part between the chip and electrode pad by using resin; a step mounting soldering balls on the rear surface of the TAB tape corresponding to the chip loading area; and a step cutting the connecting part to provide respective semiconductor device.