发明名称 RESIN COMPOSITION AND PREPARATION OF FILM THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide resin compositions suitable in producing films excellent in high tearing strength, high transparency, low temperature heat sealability or the like and good in properties such as the balance of anti-blocking properties and sliding properties and heat stability, and films and molding method thereof. SOLUTION: Resin compositions comprise [I] 100 pts.wt. ethylene (co)polymer which meets the following (a) to (d) requirements: (a) a density of 0.86-0.97 g/cm3; (b) a melt flow rate of 0.01-100 g/10 min; (c) a molecular distribution (Mw/Mn) of 1.5-5.0; and (d) a composition distribution parameter Cb of not greater than 2.00, [II] 0.01-0.5 pt.wt. heat stabilizer comprising octadecyl-3-(4'- hydroxyl-3,5'-di-tert-butylphenyl) propionate and a phosphorus type antioxidant, [III] 0.01-1.0 pt.wt. anti-blocking agent, and [IV] 0.01-0.5 pt.wt. organic fatty acid amide.
申请公布号 JP2000026669(A) 申请公布日期 2000.01.25
申请号 JP19980195475 申请日期 1998.07.10
申请人 NIPPON POLYOLEFIN KK 发明人 ASUKE TETSUYA;TAKA TOSHIO;YAGI SHINICHI
分类号 C08J5/18;C08K5/13;C08K5/20;C08L23/04;(IPC1-7):C08L23/04 主分类号 C08J5/18
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