发明名称
摘要 PROBLEM TO BE SOLVED: To provide connection of a subject plate at high density and with security. SOLUTION: A base plate member 7 holding a connecting subject plate 3 provided with line patterns 5 has a first base part, and plural second base parts 7c, and the subject plate 3 has a first plate part 3 held on a first plate part 3a held on a first one surface 7d of the first base plate, a second plate part 3b held on a second one surface of the second base part 7c, and a third plate part 3c held on its side surface 7f. The third plate part 3c has plural conductive pads connected to the respective line patterns 5 to get in contact with a contact part 34a on a mating connector 30.
申请公布号 JP3003023(B2) 申请公布日期 2000.01.24
申请号 JP19960043240 申请日期 1996.02.29
申请人 发明人
分类号 H01R13/11;H05K1/11;H05K3/40;(IPC1-7):H01R12/28 主分类号 H01R13/11
代理机构 代理人
主权项
地址