| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus for efficiently forming a polymer film for layer insulation films and a method of forming a polyimide film at a high forming rate. SOLUTION: In a semiconductor manufacturing apparatus, an evaporation- polymerizing chamber is provided with a means for cooling the surface of a wafer in the evaporation-polymerization. With the use of such an apparatus for evaporation-polymerizing raw material monomers A, B for forming a polyimide film on a wafer, the surface temp. of the wafer is set below 30 deg.C to evaporation-polymerize them to form the film. |
