| 摘要 |
PROBLEM TO BE SOLVED: To relax a stress applied to a solder bump, eliminate the disconnection of signal, and to improve reliability by allowing the elastic modulus of a bond, which presents between a stiffener and a TAB tape and bonds them, to be a specific value or less. SOLUTION: A semiconductor chip 15 mounted on a TAB tape 7 is protected with a stiffener 11 present between a cover 13 provided at the upper part of the semiconductor chip 15 and the TAB tape. A solder bump 17 is jointed to the backside of the TAB tape 7, providing a semiconductor device of a ball grid structure, mounted on a mounting substrate through the solder bump 17. The elastic modulus of a bond, which presents between the stiffener 11 and the TAB tape 7 and bonds them, is 1.0×109 Pa or below at 0 deg.C or below. With the elastic modulus of a part comprising the semiconductor chip 15, the cover 13, and the stiffener 11 being different from that of a part comprising the solder bump 17 and a mounting substrate, the distortion of the solder bump 17 is suppressed even if the solder bump 17 is applied with a stress.
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