| 摘要 |
PROBLEM TO BE SOLVED: To mold a package integrating a lead frame of a light source unit with a sufficient yield. SOLUTION: A lead frame 23 integrated into a package main body 21 of a light source unit is provided with a stage part 231 and plural leads P(n) extending outside of the package main body 21. Of these leads P(n), the leads P(13) extending outside from a sidewall 215 of the package main body 21 is a holding lead which connects the stage part 231 with a frame board 27 at a position different from those where the part 231 and the board 27 are connected by the other leads P(1)-P(12). The stage part 231 supported in cantilever by the other leads P(1)-P(12) in a mold is held at a fixed position by the holding lead P(13). As a result, it is possible to mold a package main body 21 with a lead frame having satisfactory yield. |
