LAMINATE STRUCTURE, WIRING STRUCTURE AND THEIR MANUFACTURE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laminate structure wherein the adhesion of a layer contg. an inorg. material as a main component to an org. layer can be enhanced. SOLUTION: A first layer is disposed on the main surface of a substrate having the main surface, an adhesive layer 3 is disposed on the first layer and made of fluorocarbon contg. Si, and a second layer is disposed on the adhesive layer 3. Either the first or second layer is made of a material 2 selected from among a group of materials contg. Si-contg. inorg. compds. as the main components, metals, or inorg. metal compds., and the other layer is formed of an org. insulation film 4.