| 摘要 |
<p>PROBLEM TO BE SOLVED: To expose a chip simply and safely only in the case of adjusting on the chip itself in an LSI package. SOLUTION: A window 4 in the size perfectly exposing the chip 3 is fixed on the upperside of a resin mold 1 while a lid 3 for stopping up the window 4 is set in the upperside of the resin mold 1. Guides 7 are formed as if shaving off the resin mold 1 on the side of the window 4 for grasping the lid 3 in order to remove the lid 3. The lid 3 can be removed using an instrument such as a pinset, etc., for inserting into the gaps from both side gaps of the guides 7 set in the resin mold part on the side of the lid 3. In such an arrangement, the chip 3 can be corrected in such a state and after finishing the correction work, the lid 3 is inserted into the resin mold 1 following the contrary procedures for protecting the chip 3.</p> |
