| 摘要 |
PROBLEM TO BE SOLVED: To avoid the occurrence of warpage in a semiconductor device, to improve flatness and to improve the mounting yield of the semiconductor device by manufacturing the semiconductor device by means of fixing prescribed warpage preventing resin on the other face of a double-faced substrate. SOLUTION: Even if an IC chip 43 which has multiple pins and whose chip size is small is mounted on an interposer substrate 41 whose size is large, the warpage preventing resin 47 formed of a material similar to that of sealing resin 46 along the periphery of the back 41B of the interposer substrate 41, and a chip size package(CSP) 40 is manufactured. When hear stress is given, the occurrence of warpage in CSP 40 can be avoided even if the coefficients of thermal expansion between the interposer substrate 41 and sealing resin 46 differ at the temperature of not less than a glass transfer point temperature. Thus, the long reliability of CSP 40 can be improved and the height of soldering o the interposer substrate 41 can be made uniform. |
