| 摘要 |
PROBLEM TO BE SOLVED: To enable conductive balls such as solder balls to be accurately and efficiently mounted on the board of a BGA semiconductor device or the like. SOLUTION: A mounting mask 3 where through-holes 2 slightly larger in diameter than a conductive a ball 1 are provided at positions corresponding to electrodes 50 is placed on a board 5 where a large number of electrodes 50 are provided, a large number of the conductive balls 1 are fed on the mounting mask 3, a squeegee 4 is moved to insert the conductive balls 1 into the through-holes 2 respectively, and a part of the conductive ball 1 protruding from the through-hole 2 is pressed down by the squeegee 4 to join the conductive balls 1 to the electrodes 50, respectively. |
