METHOD OF MOUNTING ELECTRONIC COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting electronic components whereby the cobwebbing of an adhesive can be prevented and troubles due to the cobwebbing can be effectively avoided in mounting the electronic components on a circuit board. SOLUTION: In a step of coating a conductive adhesive 14 on conductor lands 12 of a circuit board 11, the conductive adhesive 14 is coated, without causing the cobwebbing, using a mask 15 having a fluoro-resin 19 covering the inside faces of openings 17 to a plane facing the circuit board 11. In mounting, an IC chip 13 is adhered onto the conductive adhesive 14, without reducing the adhesion area, thereby avoiding lowering the mechanical connection strength between the IC chip 13 and circuit board 11 to avoid lowering the product quality.