MANUFACTURE OF CHIP THERMISTOR

摘要

PROBLEM TO BE SOLVED: To product a chip thermistor where effects on corrosion of a thermistor element assembly due to electrolytic plating liquid at forming a plating layer on an external electrode can be reduced. SOLUTION: Resin layers 4, 5 are formed on end surfaces 1a, 1b of a thermistor element assembly 1 having inner electrodes 2, 3, dipped in a paste of glass or inorganic materials, and insulating layers 6, 7 are formed. The insulating layers 4, 5 are degreased by baking and then eliminated, and the insulating layers on the end surfaces 1a, 1b are removed. After insulating layers 6, 7 are left only on both main surfaces 1c, 1c and both side surfaces of the thermistor element assembly 1, an external electrode is formed, and a plating layer is formed thereon.