| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflowing apparatus capable of heating a work at a uniform temp. a locally control the temp. to suppress the temp. rise of electronic components less resistive to heat. SOLUTION: The reflow apparatus for reflow-soldering a work 72 by heating it has a hot air flow rectifying mask 22 at an opening 15 for lowing a hot air 12 on the work 72, the mask 22 has a plurality of blow holes 31 for flowing the hot air 12 and a cover 32 closing part of the blow holes 31 to partly block the hot air 12 from passing. When electronic components less resistive to heat such as capacitors, etc., are mounted on a circuit board 73, the cover 32 closes only those blow holes 31 located above the capacitors 76 to reduce the quantity of the hot air blown on the capacitors 76, thereby suppressing the temp. rise of the capacitors 76.
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