发明名称 |
Method for forming a multi-anchor DRAM capacitor and capacitor formed |
摘要 |
The present invention discloses a method for forming a DRAM capacitor that has improved charge storage capacity by utilizing a deposition process wherein alternating layers of doped and undoped dielectric materials are first deposited, a deep UV type photoresist layer is then deposited on top of the oxide layers such that during a high density plasma etching process for the cell opening, acidic reaction product is generated by the photoresist layer when exposed to UV emission in an etch chamber such that the sidewall of the cell opening is etched laterally in an uneven manner, i.e., the doped dielectric layer being etched more severely than the undoped dielectric layer thus forming additional surface area and an improved charge storage capacity for the capacitor formed.
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申请公布号 |
US6015735(A) |
申请公布日期 |
2000.01.18 |
申请号 |
US19980006509 |
申请日期 |
1998.01.13 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
SHUE, SHAU-LIN;TAO, HUN-JAN;TSAI, CHIA-SHIUNG;HUANG, JENN-MING |
分类号 |
H01L21/02;H01L21/8242;(IPC1-7):H01L21/824;H01L21/302 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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