发明名称 Trench-shaped read-only memory and its method of fabrication
摘要 The present invention utilizes a first dielectric layer and a second dielectric layer overlying cell regions for storing a turned-off state or a turned-on state, respectively. The first dielectric layer is formed by local oxidation of polysilicon having a thickness greater than that of the second dielectric layer, such that the corresponding cell regions below the first dielectric layer have a threshold voltage greater than that of the second dielectric layer. Moreover, the formation of the first dielectric layer can lower the parasitic capacitance between the word lines and the bit lines as well as the substrate. Furthermore, the present invention does not require code-implantation. Thus, decreased breakdown voltage encountered in the conventional method can be avoided.
申请公布号 US6015756(A) 申请公布日期 2000.01.18
申请号 US19970898943 申请日期 1997.07.23
申请人 UNITED MICROELECTRONICS CORPORAITON 发明人 WEN, JEMMY
分类号 H01L21/8246;H01L27/112;(IPC1-7):H01L21/824 主分类号 H01L21/8246
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