发明名称 POWDERY COMPOUND
摘要 <p>PROBLEM TO BE SOLVED: To stabilize the powdery condition of a powdery compound having a high water content, contained in a packaging body. SOLUTION: A powdery compound 2 in which water and water-soluble components are contained at least by 70 wt.% or more and which has a characteristic of liquefaction caused by friction is contained in a packaging body 4 provided with the inside wall face 3 constituted of a resin having a surface tension of 40 dyne/cm or smaller and a moisture permeability of 1.0 g.mm/m2.d or smaller at the condition of 40 deg.C, 90% in relative humidity.</p>
申请公布号 JP2000014443(A) 申请公布日期 2000.01.18
申请号 JP19980185169 申请日期 1998.06.30
申请人 SHISEIDO CO LTD 发明人 BABE TAKESHI;TORII AKIHITO;YAJIMA ISAO;OKA TAKASHI
分类号 A45D33/00;A61K8/02;A61K9/14;B65D1/00;B65D1/09;(IPC1-7):A45D33/00;A61K7/00 主分类号 A45D33/00
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