发明名称 IMPEDANCE BOND
摘要 PROBLEM TO BE SOLVED: To increase a primary impedance without requiring any compensation reactor or resonance capacitor by dividing a tertiary coil into (n) pieces of winding blocks formed into a ring shape, connecting them in series at predetermined intervals, and forming them into a cylindrical shape as a whole. SOLUTION: An impedance bond 101 is provided with a primary coil 1, a secondary coil 2, a tertiary coil 3A and an iron core 4. The tertiary coil 3A is provided with winding blocks 30a-30d and connecting wires 32c, 23f, 32i. In the first winding block 30a, a lead wire is wound up in the same direction from 32a to 32c so as to be formed into a ring shape. The terminal end of the wire 32b is connected to the initial end of the wire 32c, while the terminal end of the wire 32c is connected to the terminal end of a coil wire 32d in the secondary winding block 30b. Between the respective winding blocks divided in this way, interval holding members 31a, 31b, 31c made of insulating material are arranged. In this way, the tertiary coil 3A forms four small condensers connected in series as a whole, so that distributed capacity is reduced.
申请公布号 JP2000016289(A) 申请公布日期 2000.01.18
申请号 JP19980202756 申请日期 1998.07.02
申请人 NIPPON SIGNAL CO LTD:THE 发明人 TANAKA YUTAKA;IINO SHINICHI
分类号 B61L1/18;(IPC1-7):B61L1/18 主分类号 B61L1/18
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