| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming a resist capable of improving a production yield by preventing the drop of the resist onto a wafer which is of a problem at the time of continuous work in an electrostatic coating application method, and an apparatus therefor. SOLUTION: The wafer 12 is installed in a position exclusive of the position right below a coating application nozzle 9 at the time of electrostatic coating application, by which the sag of a resist may be prevented and the production yield may be improved. Further, a mechanism for monitoring the resist component in a soln. tank 1 and automatically injecting a solvent from a solvent tank 1 into the soln. in case of the occurrence of a change is added to the apparatus, by which the change in coating application conditions may be prevented and the production yield is improved.</p> |
