| 摘要 |
PROBLEM TO BE SOLVED: To obtain a compound highly compatible with an epoxy resin of a biphenyl structure by preparing a specific epoxy compound. SOLUTION: The objective epoxy compound is represented by the formula. In the formula, R1-8 are each H, an alkyl, an alkene or a halogen; G is glycidyl; and (n) is 0 or 1. This compound is obtained, for example, by condensing 4- hydroxyphthalic acid (anhydride), trimellitic acid (anhydride) with a (substituted) aminophenol to give N-(hydroxyphenyl)-4-hydroxyphthalimide or N-(hydroxyphenyl)-4-carboxyphthalimide, and reacting the resultant imide with a biphenyl diglycidyl ether. The epoxy compound of the formula or an epoxy resin mixture constituted by mixing the epoxy compound with another epoxy resin is compounded with a polyphenol to give a curable epoxy resin composition. This composition gives a cured product excellent in adhesion and solder crack resistance.
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