High frequency component and communication apparatus incorporating the same

摘要

A high frequency component comprises a substrate (1) having a top surface; high frequency circuit components including a chip coil (3) mounted on the top of the substrate (1); and a metal cover (2) for covering the chip coil (3) on the top of the substrate (1); wherein the metal cover (2) has a hole (4) just above the chip coil (3), and the diameter or widths (w1, w2) of the hole (4) are greater that the diameter or widths of the chip coil (3) so that there is substantially a great distance between the chip coil (3) and the metal cover (2) to weaken coupling between the chip coil (3) and the metal cover (2). <IMAGE> <IMAGE>