发明名称 ELECTROLYTIC PLATING APPARATUS AND ITS CONTACTOR
摘要 PROBLEM TO BE SOLVED: To prevent the adhesion of plating to a contactor. SOLUTION: The portions of the contactor 40 exclusive of its energizing member 41 are enclosed by insulating members 44, 45 and inert fluid is supplied to its contact point (46+42+43). Bias voltage is otherwise impressed to the front end of the contactor or its circumference. As a result, the infiltration of a plating liquid 23 is prohibited and, therefore, even if a plating layer 16 is formed by energizing the object 10 for plating from a power feed source 27 via the contactor 40, the contactor 40 including the contact point is not plated.
申请公布号 JP2000017497(A) 申请公布日期 2000.01.18
申请号 JP19980180551 申请日期 1998.06.26
申请人 FOI:KK 发明人 OKUMURA YUTAKA
分类号 C25D17/10;H01L21/288;(IPC1-7):C25D17/10 主分类号 C25D17/10
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