发明名称 MOVING BLADE THERMAL STRESS REDUCING DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce thermal stress generated on a moving blade so as to prevent generation of cracking on a thermal stress generating portion. SOLUTION: For reducing thermal stress generated on a moving blade 1 by an uneven temperature difference generated on the moving blade 1 by a high temperature operating fluid 03 which flows an outer periphery and a cooling medium so as to prevent generation of a high temperature by the operating fluid 03, a plurality of slits 5 are arranged in the direction perpendicular to a direction of a generating thermal stress 4 on a thermal stress generation part 2 of the moving blade 1 where thermal stress is generated so as to reduce the magnitude of thermal stress acted on the moving blade 1 by absorbing thermal deformation of the moving blade 1 generated by the heat stress 4. Accordingly, thermal stress is released and reduced by deformation of a gap between the slits 5, and it is also possible to prevent generation of cracking generated on the moving blade 1.
申请公布号 JP2000018001(A) 申请公布日期 2000.01.18
申请号 JP19980184061 申请日期 1998.06.30
申请人 MITSUBISHI HEAVY IND LTD 发明人 KANEKO HIDEAKI
分类号 F01D5/18;(IPC1-7):F01D5/18 主分类号 F01D5/18
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