发明名称 |
CHARGE COUPLED DEVICE PACKAGE |
摘要 |
PURPOSE: A charge coupled device package is to improve the reliability by preventing the adhesion position inferiority of a transparent glass and a mold frame without increasing the whole size of the package. CONSTITUTION: A method increases the reliability of a charge coupled package(100) by preventing the water drop phenomenon by; coating an adhesion(150) to attach a transparent glass(110) on the top surface of a mold frame(120) where a charge coupled device chip(130) and a lead frame(140) are installed; forming a projection protruded from the mold frame to prevent the adhesion position inferiority of the transparent glass and the mold frame; and attaching the transparent glass to the adhesion in the state that the transparent glass is fixed on a proper position by the projection.
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申请公布号 |
KR20000000675(A) |
申请公布日期 |
2000.01.15 |
申请号 |
KR19980020431 |
申请日期 |
1998.06.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, JONG KON |
分类号 |
H01L23/28;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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