发明名称 CHARGE COUPLED DEVICE PACKAGE
摘要 PURPOSE: A charge coupled device package is to improve the reliability by preventing the adhesion position inferiority of a transparent glass and a mold frame without increasing the whole size of the package. CONSTITUTION: A method increases the reliability of a charge coupled package(100) by preventing the water drop phenomenon by; coating an adhesion(150) to attach a transparent glass(110) on the top surface of a mold frame(120) where a charge coupled device chip(130) and a lead frame(140) are installed; forming a projection protruded from the mold frame to prevent the adhesion position inferiority of the transparent glass and the mold frame; and attaching the transparent glass to the adhesion in the state that the transparent glass is fixed on a proper position by the projection.
申请公布号 KR20000000675(A) 申请公布日期 2000.01.15
申请号 KR19980020431 申请日期 1998.06.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JONG KON
分类号 H01L23/28;(IPC1-7):H01L23/28 主分类号 H01L23/28
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