SEMICONDUCTOR CHIP PACKAGE MANUFACTURING AND FACILITY

摘要

PURPOSE: A semiconductor chip package manufacturing device is provided to minimize the working manpower and the waiting time consumed between each facility by being on-line of the relevant facility of each processing. CONSTITUTION: The semiconductor chip package manufacturing device comprises: a stocker(10) for loading and unloading of a tray for storing the semiconductor chip package; a marking unit(12) for proceeding the marking processing toward the surface of the semiconductor chip package in the tray; an examining unit(38) for examining the outside state of the semiconductor chip package; and a packing unit(16) for packing the semiconductor chip package toward the good products according the examining consequences of the examining unit(38).